Shaping the Future of Semiconductors

ATPION is a pioneering semiconductor company focused on Assembly, Testing, and Packaging (ATP) solutions in North America. We aim to strengthen the regional semiconductor supply chain by providing advanced packaging, testing services, and substrate innovations that reduce dependency on Asia.

We specialize in:

Assembly & Packaging of semiconductors especially in fcBGA. Future services will include (standard packages to advanced fan-out and 3D integration).

Testing & Validation to ensure chips meet performance, reliability, and safety requirements.

Research & Development in next-gen packaging, substrates, and photonics.

Collaborations with research centers to accelerate innovation and bring lab breakthroughs to scalable production.

The global semiconductor industry is heavily concentrated in Asia (90%+ of packaging & testing). This creates supply chain risks for North America. ATPION was created to:

Nearshore critical operations under USMCA.

Support the CHIPS Act goals of localizing advanced semiconductor capabilities.

Build a sustainable ecosystem of innovation, education, and high-value jobs in Mexico and North America.

ATPION is headquartered in Mexico, strategically located to serve both U.S. and Latin American markets, while benefiting from trade agreements and proximity to leading tech companies.

Technology & Services

5. What semiconductor services does ATPION offer?

Assembly & Packaging: Standard IC packaging, and fcBGA.

Future developments include advanced fan-out, 2.5D/3D integration, photonic-enabled packaging.

Testing: Electrical testing, reliability testing, burn-in, and system-level validation.

Substrates: Development and adaptation of new substrate technologies (SiC, glass, adaptive patterning).

R&D Projects: Collaborative programs with universities, startups, and global innovators.

Location Advantage: First mover in North American ATP, reducing reliance on Asia.

Innovation-First Approach: Strong ties to research centers to continuously develop new packaging technologies.

Customer Focus: Tailored solutions for AI, automotive, energy, and telecom applications.

Sustainability: Commitment to eco-friendly processes and workforce development in Mexico.

AI & High-Performance Computing (HPC)

Automotive (EVs, ADAS, power electronics)

5G/6G Telecom & Networking

IoT & Consumer Electronics

Energy & Renewable Systems

No. While packaging and testing are our core, we are committed to substrate innovation and photonics integration—technologies that will define the next decade of semiconductors.

Innovation & Partnerships

Our innovation model includes:

Synergies with research centers & universities for photonics, substrates, and 3D integration.

Partnerships with global IP leaders like Deca (for Adaptive Patterning) or others.

Collaborative R&D projects funded by governments or corporate partners.

A continuous self-learning culture, encouraging engineers to push boundaries.

Mexico is becoming a semiconductor hub due to:

Strategic proximity to the U.S.

USMCA trade benefits

A growing talent pool of engineers and universities investing in microelectronics programs.

ATPION is positioning itself as the anchor ATP player in Mexico.

While we can’t disclose all names publicly, ATPION is in conversations with:

Global packaging technology licensors (for IP transfer).

North American OEMs (AI, EV, and telecom companies).

Research institutions in Mexico and the U.S. for joint development.

We work with partners through:

Licensing & Tech Transfer

Joint Development Programs (JDPs)

Customer-Specific Alliances

Research Collaborations with universities and labs

Market & Growth

The global chip shortage exposed supply chain vulnerabilities.

AI & EV demand is pushing packaging and substrates to new limits.

Governments are incentivizing local production via the CHIPS Act.

ATPION sits at the intersection of innovation, regionalization, and demand.

Global ATP (Assembly, Testing, Packaging): ~$150B by 2030.

Advanced Packaging (fan-out, 3D): Fastest-growing segment at >10% CAGR.

North American opportunity: Billions in demand currently sourced from Asia.

Global OSAT leaders (ASE, Amkor, JCET, SPIL, Unimicron) dominate Asia.

ATPION differentiates by being the only advanced packaging & testing company based in North America.

Packaging & Testing Services (per unit pricing).

IP-based Licensing & Partnerships.

Custom Development Contracts with OEMs.

Collaborative R&D programs with funding institutions.

Investment & Future

ATPION differentiates by being the only advanced packaging & testing company based in North America.

Currently, ATPION is pre-revenue but has strong lead interest from industry players and is building its first partnerships and pilot programs.

ATPION is in early-stage fundraising (pre-seed/seed). Funds are used for:

Building pilot facilities in Mexico.

Securing technology licenses.

Expanding engineering and R&D teams.

Be the leading ATP company in North America.

Drive innovation in advanced packaging, substrates, and photonics.

Build a semiconductor ecosystem in Mexico, supporting education and sustainability.

Help North America regain resilience and independence in semiconductors.

We welcome collaboration through:

Equity investment (venture capital, corporate investment).

Strategic partnerships (co-development, IP licensing).

Government programs supporting semiconductor growth.

Drive innovation in advanced packaging, substrates, and photonics.

Build a semiconductor ecosystem in Mexico, supporting education and sustainability.

Help North America regain resilience and independence in semiconductors.

Implementing eco-friendly packaging & testing processes.

Reducing global shipping emissions by nearshoring production.

Supporting STEM education in Mexico to create long-term local impact.