A pioneer Assembly, Test and Packaging (ATP) company in Mexico.
We serve fabless semiconductor companies, IDMs, and
automotive/industrial OEMs looking for a trusted, nearshore
alternative to Asia-based back-end operations.
No OSAT south of Phoenix addresses these segments.
Innovation, quality, collaboration, integrity, and sustainability are our
core values.
Competitive Advantages
Our Commitment To Innovation
Innovation is at the heart of what we do. As industries such as AI and 5G evolve, the demand for high-performance chips and semiconductor packaging solutions increases. ATPION is uniquely positioned to meet these demands through continuous research and development.
Our team works closely with industry leaders to ensure we remain at the forefront of technological advancement, delivering solutions that are both cutting-edge and scalable.
Competitive Advantage
Near-shore agility:
Shared time zones and 4–5-day door-to-door logistics, reducing working capital needs and design-to-ramp latency.
Zero-defect from day one:
We’re building ISO 9001 and IATF 16949 into our launch,
SPC/MES traceability and an 8D closure goal of under five days.
Low-volume, high-mix NPI cell:
<2-hour changeovers and 72-hour proto-to-qual paths keep Wi-Fi 7 FEMs and V2X modules on track.
Smart MES + practical AI:
We’re integrating Advantest/Exensio analytics directly with wafer probe and strip test.
Compliance:
Fully compliant with ISO, IATF, and ESG standards
Full-spectrum RF test:
Wafer, strip, ATE, SLT, and bench test under one roof ensures a seamless, vertically integrated flow.
ATPION is a pioneering semiconductor company focused on Assembly, Testing, and Packaging (ATP) solutions in North America. We aim to strengthen the regional semiconductor supply chain by providing advanced packaging, testing services, and substrate innovations that reduce dependency on Asia.
The global semiconductor industry is heavily concentrated in Asia (90%+ of packaging & testing). This creates supply chain risks for North America. ATPION was created to:
Nearshore critical operations under USMCA.
Support the CHIPS Act goals of localizing advanced semiconductor capabilities.
Build a sustainable ecosystem of innovation, education, and high-value jobs in Mexico and North America.
ATPION is headquartered in Mexico, strategically located to serve both U.S. and Latin American markets, while benefiting from trade agreements and proximity to leading tech companies.
Technology & Services
5. What semiconductor services does ATPION offer?
Assembly & Packaging: Standard IC packaging, and fcBGA.
Future developments include advanced fan-out, 2.5D/3D integration, photonic-enabled packaging.
Testing: Electrical testing, reliability testing, burn-in, and system-level validation.
Substrates: Development and adaptation of new substrate technologies (SiC, glass, adaptive patterning).
R&D Projects: Collaborative programs with universities, startups, and global innovators.
